OMRON Industrial Automation Malaysia Northern Region Penang Sole distributor - Omron VT-WIN ll
A new version that provides even greater speed and higher performance

The revised VT-WINII provides a 15% faster inspection speed (in-house comparison) to meet current trends in the SMT industry. The precision of lead float inspections for mini-mold components has been dramatically improved.
Omron’s commitment to continuous improvement and innovation assures a steady stream of advancements to further automate and simplify the inspection process.
Omron’s VT-WIN II combines innovative technologies, unrivaled speed and easy-to-use functionality that offers advances in solder inspection, component fault detection and process speed which gives you a competitive edge in productivity, waste reduction and quality control.
By integrating VT-WIN II into your process, you will improve production and inspection quality, verify process engineering and allow for a more efficient distribution of resources.

The VT-WIN II delivers these major improvements:

• Supreme Inspection Performance - Improved Precision
• Highly Efficient System Operation - VTnx
• Unique Quality Improvement Solutions - QupNavi

One Key to Success…..
VT-WIN II utilizes Omron’s patented Color Highlight Technology
to identify the shape of the solder joint leaving the rest of the colors of the substrate and component undisturbed. This patented system allows the VT-WINII to detect minute flaws that would ordinarily be missed.


Improved Precision

Lead floatation of mini-mold components can be precisely inspected by using a combination of colour highlight illumination and newly developed lead extraction logic.

Faster Inspection

Inspection speed has been increased from approximately 280 ms/image to approximately 240 ms/image with a high-resolution 3-CCD camera and improved software. (Inspection speed may differ depending on the PCB.)



Angled View Inspection Functio

Images are taken along two different optical axes, a direct view and an angled view, using only one camera by changing the axis with special mirrors located between the camera and PCB. Combining these images enables difficult inspections, such as inspecting solder directly under leads. This feature is also effective for inspecting PLCC, SOJ, and similar chips.




By integrating each system into the process, it will improve production and inspection quality, verify process engineering and allow for a more efficient distribution of resources. The benefit rich inspection system will positively impact multiple areas in the process including post paste, post placement, post wave and/or post reflow.




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